Solder paste for JET-DISPENSINGSolder paste for JET-DISPENSING

Features

  • For 3D mounted substrate
  • Stencil-less process
  • Compatible with 3D-MID
  • Good workability (Defect reduction)
  • For additional solder with non-contact


    • ※Jet dispensing is one of the methods of paste application to PCB with non-contact

Application

  • Mobile device
  • Household appliances
  • Automotive
  • LED
  • Chip component
  • FPC

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