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- GP-217 Series Low silver(1.0Ag) content lead-free solder paste
Low Silver Content Lead-free Solder PasteGP-217 Series Low silver(1.0Ag) content lead-free solder paste
Cost reduction！
Features
- Price reduction with ensuring reliability (Recommended ally composition by JEITA)
- Halogen-free (IPC)
- Excellent printability
- Good wettability to components
Application
- Wind/Solar power generation
- Mobile Device
- Household appliances
- Automotive
- LED
- FPC
- Chip component
- Industrial machinery
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