High heat-resistant solder paste for automotiveTLF-286 Series

Highly reliablity solder paste for automotive

Features

◎For automotive

  • Ensure high reliability under harsh environments
    　⇒Control solder deformation against the stress during thermal cycles
    　⇒Control Cu６Sn５ coarsening in solder filet
    　⇒Control IMC coarsening in the layer
  • Improve product reliability by preventing flux residues from getting cracked

    • ※ Solder alloy composition: Patent No. 6047254

Application

  • Wind/Solar power generation
  • Household appliances
  • Automotive
  • Chip component
  • Industrial machinery

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