Solder resist for flexible substratesTamura Photo Imageable Coverlay Coat

Proposal of flexible functional module using PICC (photo imageable coverlay coat) (trademark registration pending)

What is a flexible functional module?
Features
Video for presentation of technology
Catalog download



What is a flexible functional module?

A unit that realizes high-density mounting, light weight, thinness, and free design

● Multi-functionalization of wire harness
● FPC conversion of antenna cable of mobile device
● Lightweight and multi-functionalization of CASE electronic board for 5G/6G　
● Wearable compatible
● Healthcare and medical equipment

Features

◆Low exposure energy and high resolution




◆High insulation resistance




◆Low spring back





◆High bending property




Items Test Condition PAF,APB-800 Series
(Liquid type)		 TPL-800 Series
(Film type)
Appearance
  • Visual inspection
  • Amber gloss / Black Matte
  • Amber gloss / Black Matte
Exposure energy
  • DI Exposure machine
  • 100 ～ 200mJ/cm2
  • 100 ～ 200mJ/cm2
Film hardness
  • JIS K5400
  • 2H
  • 3H
Adhesion Cross cut test1
  • On Polyimide
  • 100/100
  • 100/100
Adhesion Cross cut test2
  • On Copper
  • 100/100
  • 100/100
Acid resistance
  • 10％HCl-15min tape peeling test
  • No Delamination
  • No Delamination
Solvent resistance
  • IPA-30min tape peeling test
  • No Delamination
  • No Delamination
UL
  • U L - 94
  • VTM -0 equiv.
  • VTM -0 equiv.



Catalog Download

Select from Other Product

Pickup

TOP