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- BF-31 Tacky flux for ball attach application
Tacky Flux for Ball Attach ApplicationBF-31 Tacky flux for ball attach application
Capable of high soldering quality
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BF-31
Features
- Stencil printing applicable
- Removal of residue is easy even after high temperature reflow for high melting point solders
Application
- Semiconductor package
- Chip component
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